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國立清華大學「ASME Journal of Electronic Packaging (JEP) 」徵稿，本次徵件主題： Reliability of 3D IC packaging: Recent Progresses in Analysis, Simulation and Experimental Methodology。
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National Tsing Hua University
Call for Submissions: ASME Journal of Electronic Packaging (JEP)
**Special Issue Topic: Reliability of 3D IC Packaging: Recent Progresses in Analysis, Simulation, and Experimental Methodology**
The ASME Journal of Electronic Packaging (JEP) is currently inviting submissions for a special issue focusing on the reliability of 3D IC packaging. The theme of this call for submissions is:
**Reliability of 3D IC Packaging: Recent Progresses in Analysis, Simulation, and Experimental Methodology.**
Researchers and scholars are encouraged to submit original research articles, review articles, and technical notes relevant to the topic. Submissions should present novel insights, methodologies, or experimental results that contribute to the advancement of reliability analysis, simulation techniques, and experimental methodologies in the field of 3D IC packaging.
For detailed submission guidelines and deadlines, please refer to the official call for submissions on the ASME JEP website. |
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